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Optoelectronics Industry
LED substrate drilling / Semi-automatic under-fill removing machine
Semi-automatic under-fill removing machine
LM-C10-MZ70
- Non-contact machining without issues of knife change, fracture and abrasion.
- Permanent marking, fine removing result that improves product quality.
- Computer Graphics that allows small batch proofing and no moldmaking is required.
- Applicable to a variety of materials without limit on hardness.
- Under-fill removing is done directly without cleaning surface of object, simplifying production.
- Applicable to curved surface.
- Comprehensive automation design applicable to both large-batch and small-batch production.
- 【Application areas】 Customizable for SMT, FPC, PCB and optoelectronic industries.
- 【Product number】 LM-C10-MZ70
Technical specification
Detailed related technical specifications.
| Dedicate laser refill removing system – best choice for system integration and automation | |
|---|---|
| Size of laser underfill removing machine (cm) | 115x70x75cm |
| Laser Wavelength | 10.6 um |
| Laser Type | Sealed, RF Excited CO2 Lase |
| Beam Mode | TEM00,95% Purity, ‹ 1.2 |
| Output Power (max.) | 10 Watts |
| Pulse Width Modulation | ~20KHz |
| Field Size (mm) | 70X70 |
| Dimensions of Laser Head (mm) | 760(L)X173(W)X236(H) |
| Weight of Laser Head (Kg) | 15 |
| Cooling Requirement | Forced air cooling |
| Electrical Power | 1¢100~200VAC，20/60 Hz，2.5AMP |
| Control interface | 16Bit Analog PCI Bus or Bit Digital USB Mode |
| PC Requirement | Pentium or above, with CD drive, floppy drive, keyboard, mouse, monitor, USB Port, PCI slot |
| Specification may vary due to technical requirement with no further notice | |
