Semiconductor Industry

雷科股份有限公司

持續創新改善 全員追求卓越

Continuous innovation and improvement
All employees pursue excellence
  • Passive Component Industry
    Passive Component Industry
  • PCB/FPC Industry
    PCB/FPC Industry
  • Semiconductor Industry
    Semiconductor Industry
  • Optoelectronics Industry
    Optoelectronics Industry

Semiconductor Industry

Laser marking

可搭配各種金屬導線架材質進行雷射雕刻

TSV (Through-Silicon Via) 已擔任主要的連結通道角色, TSV立體堆疊技術

Capable of 1D/2D barcode or any laser marking

Spatter-free after marking

Dual-head laser design that improves capacity.