持續創新改善 全員追求卓越
Continuous innovation and improvement
All employees pursue excellence
Semiconductor Industry
Laser marking
可搭配各種金屬導線架材質進行雷射雕刻
TSV (Through-Silicon Via) 已擔任主要的連結通道角色, TSV立體堆疊技術
Capable of 1D/2D barcode or any laser marking
Spatter-free after marking
Dual-head laser design that improves capacity.