Semiconductor Industry

雷科股份有限公司

持續創新改善 全員追求卓越

Continuous innovation and improvement
All employees pursue excellence
  • Passive Component Industry
    Passive Component Industry
  • PCB/FPC Industry
    PCB/FPC Industry
  • Semiconductor Industry
    Semiconductor Industry
  • Optoelectronics Industry
    Optoelectronics Industry

Semiconductor Industry

Laser marking

TSV Si Wafer Drilling 雷射晶圓矽通孔

TSV Si Wafer Drilling 雷射晶圓矽通孔

TSV (Through-Silicon Via) 已擔任主要的連結通道角色, TSV立體堆疊技術

Wafer Laser Trim 雷射晶圓修阻機

Wafer Laser Trim 雷射晶圓修阻機

Wafer Laser Grooving 雷射開槽

Wafer Laser Grooving 雷射開槽

Single-head laser barcode marking machine

Single-head laser barcode marking machine

Capable of 1D/2D barcode or any laser marking

Wafer Laser Marking

Wafer Laser Marking

Spatter-free after marking

Laser Marking

Laser Marking

Dual-head laser design that improves capacity.