持續創新改善 全員追求卓越
Continuous innovation and improvement
All employees pursue excellence
Semiconductor Industry
Laser marking /
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Purpose of Use
Used in mass production lines to ensure cleaning consistency, yield, and stable production cycles, high-precision cleaning without damaging the substrate.
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Main Purpose
Put into mass production, improve yield, reduce cleaning time, stabilize processes.
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Laser Module
Uses high-stability laser source, supports custom energy curves and higher pulse repetition rates.
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Optical System
High-end lens + custom spot optimization, adjusted for customer probe density/angle.
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Fixture Design
Custom precision fixture (including angle compensation, high-precision X/Y/Z adjustment).
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Processing Speed
Industry's fastest line scanning method, effectively improving processing speed.
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Software Features
Complete interface: recipe management, point recording, history tracking, MES integration.
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Automation Capability
Supports full automation: Tray loading/unloading, positioning camera, AI detection of contamination points.
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Reliability
Designed for long-term mass production.
Product processing instruction
Other Product Description
Before Processing - Central Area Probe (High Magnification Microscope)
After Processing - Central Area Probe Cleaning Excellent. Substrate Undamaged
Before Processing - Lower Right Area Probe (High Magnification Microscope)
After Processing - Lower Right Area Probe Cleaning Excellent. Substrate Undamaged
Before Processing - Right Side Area Probe (High Magnification Microscope)
After Processing - Right Side Area Probe Cleaning Excellent. Substrate Undamaged
