Wafer Laser Marking

雷科股份有限公司

持續創新改善 全員追求卓越

Continuous innovation and improvement
All employees pursue excellence
  • Passive Component Industry
    Passive Component Industry
  • PCB/FPC Industry
    PCB/FPC Industry
  • Semiconductor Industry
    Semiconductor Industry
  • Optoelectronics Industry
    Optoelectronics Industry

Semiconductor Industry

Laser marking / Wafer Laser Marking

Wafer Laser Marking
Wafer Laser Marking

  • Spatter-free after marking.
  • Stack to Stack mode or Cassette to Cassette mode。
  • Meeting the cleanliness level for fabrication.
  • Automatic loading and unloading that reduces production hours. Method of loading and unloading can be customized.
  • 【Application】 Wafer Laser Marking

Product processing instruction

Other Product Description

Technical specification

Detailed related technical specifications.