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PCB/FPC Industry
FPC Industry / Automatic under-fill removing machine
Automatic under-fill removing machine
LM-C10-AZ200
- Non-contact machining without issues of knife change, fracture and abrasion.
- Fine removing result that improves yield.
- Computer Graphics that allows small batch proofing and no moldmaking is required.
- Applicable to a variety of materials without limit on hardness.
- Under-fill removing is done directly without cleaning surface of object, simplifying production.
- Applicable to curved surface.
- Comprehensive automation design applicable to both large-batch and small-batch production.
- Providing automatic image navigation to ensure precise workpiece position with the height measuring sensor that automatically measures workpiece focal length. Recording multiple sets of laser machining parameter. User friendly.
- 【Application areas】 Customizable for SMT, FPC, PCB and optoelectronic industries.
- 【Product number】 LM-C10-AZ200
Technical specification
Detailed related technical specifications.
Dedicate laser refill removing system – best choice for system integration and automation | ||
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Size of laser underfill removing machine (cm) | 113x65x134cm | |
Laser Wavelength | 10.6 um | |
Laser Type | Sealed, RF Excited CO2 Lase | |
Beam Mode | TEM00,95% Purity, 1.2 | |
Output Power (max.) | 10 Watts | |
Pulse Width Modulation | ~20KHz | |
Field Size(mm) | 70X70 | |
Spot Size (um) | 130 | 210 |
Dimensions of Laser Head(mm) | 760(L)X173(W)X236(H) | |
Cooling Requirement | Forced air cooling | |
Electrical Power | 1¢100~200VAC,20/60 Hz,2.5AMP | |
Control interface | 16Bit Analog PCI Bus 或Bit Digital USB Mode | |
PC Requirement | PC Requirement: Pentium or above, with CD drive, floppy drive, keyboard, mouse, monitor, USB Port, PCI slot | |
Specification may vary due to technical requirement with no further notice |