FPC/PCB Industry PCB

雷科股份有限公司

持續創新改善 全員追求卓越

Continuous innovation and improvement
All employees pursue excellence
  • Passive Component Industry
    Passive Component Industry
  • PCB/FPC Industry
    PCB/FPC Industry
  • Semiconductor Industry
    Semiconductor Industry
  • Optoelectronics Industry
    Optoelectronics Industry

FPC/PCB Industry

PCB

搭配飛秒雷射, 冷加工技術, 不損毀材料

Depending on materials, several laser types may be chosen from

Innovative specialized cutting technique with minimal carbonization on surface

Reducing the loss on yield and work hours by manual operation

Equipped with highly stable German fiber laser and exhibiting stable utilization

Non-contact machining without issues of knife change, fracture and abrasion

Under-fill removing is done directly without cleaning surface of object, simplifying production procedures