持續創新改善 全員追求卓越
Continuous innovation and improvement
All employees pursue excellence
Semiconductor Industry
Laser marking / Wafer Laser Trim 雷射晶圓修阻機
Product processing instruction
Other Product Description
Technical specification
Detailed related technical specifications.
| 項目 | 規格 | ||
|---|---|---|---|
| 系統 | 內含：光源、載台控制系統、電腦等 | 外觀尺寸 | 1650mm(W)X1000mm(L)X1800mm(H)(不含三色警示燈) |
| 重量 | 1800kg | ||
| 台面 | XY行程 | Lens FOV | 17mmx17mm |
| Spot Size | 6μm | ||
| 光源 | 雷射波長 | UV 355nm | |
| 功率 | 1W(0.2uJ~10uJ@50KHz) | ||
