LED Laser Drill/Scribing

持續創新改善全員追求卓越

高速加工機種，可達40孔/秒

Applicable to all kinds of ceramic material processing.
High-precision drilling, scribing, abnormal shape cutting can be done at the same time.
High output up to 40 holes/sec.
Automatic production that reduces loss from manual loading and saves labor cost.
Easy loading and reloading with low maintenance cost.
Model with the most market share.
First choice for vehicle-to-everything.
High-precision navigation applicable to substrate post-processing.
Optional light source for product post-processing with low sputter effect.

Ceramic PCB

Target process

1.Scribing process (continuous scribe line)

2.Scribing process (continuous scribe line)

1.Square hole cutting process

2.Square hole cutting process

Round hole process

1.Cutting and scribing surface state

2.Cutting and scribing surface state

Scribing process (dot matrix)

1.Scribing process (dot matrix side view)

2.Scribing process (dot matrix side view)

1.Round hole process (side view)

2.Round hole process (side view)

Items			Specification
System	Includes: Light source, stage control system, computer, etc.	Dimension	1200mm(W)X1300mm(L)X1800mm(H)(stacklight not included)
System		Weight	1500kg
Stage	XY-axis	Stage table size	400mmX300mm
Stage	XY-axis	Light source	Laser wavelength
Light source	Laser wavelength		IR 1064 nm	IR 1064 nm
Light source	Power		500W	50W