Thin Film Laser Trimmer S8

雷科股份有限公司

持續創新改善 全員追求卓越

Continuous innovation and improvement
All employees pursue excellence
  • Passive Component Industry
    Passive Component Industry
  • PCB/FPC Industry
    PCB/FPC Industry
  • Semiconductor Industry
    Semiconductor Industry
  • Optoelectronics Industry
    Optoelectronics Industry

Passive Component Industry

Thick Film Trimmer ALL / Thin Film Laser Trimmer S8

TF-3050 S8
Thin Film Laser Trimmer S8

TF-3050 S8

  • A new generation platform for trim and test of Thin Film chip components.
  • Ability to trim substrates with resistors of size 0201(inches).
  • Capability to trim from milli-ohms(mΩ) to Mega-ohms(MΩ).
  • Advanced vision and motion subsystems provide improved positioning and alignment capability.
  • Improved pick up arm for efficient pick up and placing of substrates.
  • Windows 10 operating system with WINLTS (Chinese/English) Trimmer software.
  • Can be integrated with lasers of 3 different wavelengths(355nm, 532nm, 1064nm).
  • 【Laser Type】 Diode pumped Q-switched (532nm)
  • 【Application】 Thin-film R-SMD Laser Trimmer