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Cyber應用
Thickness measurement in production processes and material testing is becoming more and more important.
TOTAL THICKNESS VARIATION(TTV)
The CT T Series of cyberTECHNOLOGIES is designed for measuring top and bottom side of parts like wafers, substrates, or other mechanical parts. The system measures absolute thickness, thickness variation (TTV), bow and warp, and with an adapter plate to the system can be used as a standard surface measurement system.
- 【應用實例】 ct-250T、ct-350T
Product Description
Other Product Description
TOTAL THICKNESS VARIATION (TTV)
TOTAL THICKNESS VARIATION (TTV)
- Thickness measurement in production processes and material testing is becoming more and more important.
SILICON WAFER
SILICON WAFER
- 3D Thickness Map of a Silicon Wafer
- Fast and accurate thickness measurement over large areas
- Total Thickness, Total Thickness Variation, Warpage, Bow, Stress
FUEL CELL
FUEL CELL
- 3D image of the front and back-side a Fuel Cell Anode
- double-sided waviness and parallelism
- Sub-micron thickness accuracy from 10 µm to 80 mm total thickness
SOLAR CELL
SOLAR CELL
- 2D profile of front- and back-side Metallization Layer
- Accurately aligned top and bottom scans
- Collect and analyze, top-, bottom and thickness data
