FLATNESS MEASUREMENT

雷科股份有限公司

持續創新改善 全員追求卓越

Continuous innovation and improvement
All employees pursue excellence

Cyber應用

Measuring the flatness of electronic components and wafers.

Vantage 1
FLATNESS

Flatness measurement is required for a lot of components including wafers, optical and mechanical parts. Using our non-contact 3D measurement technology, accurate flatness measurement can be achieved over large areas.

Product Description

Other Product Description

FLATNESS MEASUREMENT FLATNESS MEASUREMENT
FLATNESS MEASUREMENT
  • Measuring the flatness of electronic components and wafers
ELECTRONIC COMPONENT ELECTRONIC COMPONENT
ELECTRONIC COMPONENT
  • Countour map of an electronic component
  • Advanced etch removing and modifiying algorithms
  • Use polygon shape cursors to mark region of interest
HARD DISK DEVICE HARD DISK DEVICE
HARD DISK DEVICE
  • Contour map of hard disk device
  • Effective filters to separate flatness from surface roughness
  • Measuring the flatness relative to reference areas
SURFACE OF A WAFER SURFACE OF A WAFER
SURFACE OF A WAFER
  • Surface of a wafer
  • Accurate flatness measurement over large areas
  • Colors can be set to specification limits
Depth of laser scribing DIE TILT– LEADFRAME
DIE TILT– LEADFRAME
  • 3D Image die tilt
  • Measures Die Tilt, BLT height and Position
  • Rotation and offset relative to cavity center
Cybe FLATNESS MEASUREMENT FLATNESS MEASUREMENT