CT 300

• 2D/3D non-contact profiling system[measuring]3D (x, y, z)2D (y, z or x, z), Height, Height (Avg), Length, Volume, Angle, Angle (Planar), Center, Roughness, Radius (Avg, Max, RMS, Rz), Roughness (Avg, Max, RMS, Rz).
• Laser non-contact measurement applicable to both dry and wet films.
• Multi-points automatic measurement available with analysis result.

• Thickness measurement of thick film printing, hybrid circuits, BGA, TAB and FLIP CHIP.

• PCB substrate deformation, quality inspection of semiconductor components and wafers, measurement of thickness and roughness of copper clad laminate, thickness of solder mask and silkscreen, bump inspection, flatness measurement of die attachment, 12＂wafer warpage.

• Semiconductor industry packaging and testing, optoelectronic industry, PCBs fabrication, SMT industry, hybrid circuits, passive components.