Under-fill Laser removing machine

雷科股份有限公司

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All employees pursue excellence
  • Passive Component Industry
    Passive Component Industry
  • PCB/FPC Industry
    PCB/FPC Industry
  • Semiconductor Industry
    Semiconductor Industry
  • Optoelectronics Industry
    Optoelectronics Industry

PCB/FPC Industry

FPC Industry / Under-fill Laser removing machine

Under-fill Laser removing machine
Under-fill Laser removing machine
  • Reducing the loss on yield and work hours by manual operation.
  • Simple graphical user interface that is easy to use.
  • Mounted height measuring sensor provides flatness for underfill removal.
  • Realizing multiple times of process and height-measured underfill removing.
  • 【Laser Type】 CO2 laser
  • 【Application】 Laser underfill removing machine for BGA rework underfill

Product Description

Other Product Description

HDI underfill removing HDI underfill removing
HDI underfill removing HDI underfill removing